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Intel LGA1700 Series
MODEL: 1U_V11
Keyword:
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- Description
-
• DIMENSIONS: 90(L)*90(W)*25.0mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Copper FIN + Copper VC
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.7mm
• POWER DISSIPATION: 200W
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